SUNLU PLA+ 2.0 High Speed

PLA by SUNLU · Generic

Diameter

1.75mm

Nozzle temperature

205–220°C (rec. 210°C)

Bed temperature

40–60°C (rec. 55°C)

Print speed

50–300 mm/s

Density

1.24 g/cm³

Upgraded high-speed PLA+ 2.0, best layer adhesion at speed, 195-205C for standard, 205-220C for high speed